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PCN210503 | Cypress Semiconductor

PCN210503

Last Updated: 
Mar 25, 2021

Ø Issue Date: March 22, 2021

Ø Effectivity Date: June 22, 2021

Ø Description: Qualification of Copper Palladium Gold Wire (CuPdAu) and Shinetsu KMC3580LVA Mold Compound for FBGA Packages Memory Products