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PCN210502 | Cypress Semiconductor

PCN210502

Last Updated: 
Mar 31, 2021

Ø Issue Date: March 30, 2021

Ø Effectivity Date: June 30, 2021

Ø Description: Qualification of PTI-TW as an Additional Wafer Bump Site for Select UMC Plated Bump Flip Chip FBGA (FCFBGA) IOT Products