PCN193704 | Cypress Semiconductor
PCN193704
Last Updated:
Sep 13, 2019
Ø Issue Date: Sept 12, 2019
Ø Effectivity Date: Dec 12, 2019
Ø Description: Qualification of Cypress Thailand as an Additional Assembly Site and PTI-SG as an Additional Wafer Bumping Site for Select 252-Ball Flip Chip FBGA (FCFBGA) IoT Products
Related Files
| File Title | Language | Size | Last Updated |
|---|---|---|---|
 PCN193704 Affected Parts List.xls |
English | 65.5 KB | 09/13/2019 |
 PCN193704.zip |
English | 8.18 MB | 09/13/2019 |