PCN192701 | Cypress Semiconductor
PCN192701
Last Updated:
Apr 14, 2020
Ø Issue Date: July 15, 2019
Ø Effectivity Date: October 15, 2019
Ø Description: Qualification of Cypress Thailand as an Additional Assembly Site and PTI-SG as an Additional Wafer Bumping Site for Select 300-Ball Flip Chip BGA (FCBGA) IoT Product
Related Files
| File Title | Language | Size | Last Updated |
|---|---|---|---|
 PCN192701 Affected Parts List.xls |
English | 29.5 KB | 07/17/2019 |
 PCN192701.zip |
English | 5.92 MB | 07/17/2019 |