PCN192401 | Cypress Semiconductor
PCN192401
Last Updated:
Apr 14, 2020
Issue Date: June 10, 2019
Ø Effectivity Date: September 10, 2019
Ø Description: Qualification of Nitto EM-760 Die Attach Film and Die Thickness Change for 44-Lead TSOP II 2-Die Stack Package Assembled at OSE-Taiwan
Related Files
| File Title | Language | Size | Last Updated |
|---|---|---|---|
 PCN192401 Affected Parts List.xls |
English | 38.5 KB | 06/10/2019 |
 PCN192401.zip |
English | 3.5 MB | 06/10/2019 |