PCN191203 | Cypress Semiconductor
PCN191203
Last Updated:
Apr 14, 2020
Ø Issue Date: March 19, 2019
Ø Effectivity Date: June 19, 2019
Ø Description: Qualification of Cypress Thailand as an Additional Assembly Site and PTI-SG as an Additional Wafer Bumping Site for Select 49-Ball Flip Chip BGA (FCBGA) IoT Products
Related Files
| File Title | Language | Size | Last Updated |
|---|---|---|---|
 PCN191203 Affected Parts List.xls |
English | 30.5 KB | 03/20/2019 |
 PCN191203.zip |
English | 7.2 MB | 03/20/2019 |