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PCN190302 | Cypress Semiconductor

PCN190302

Last Updated: 
Jan 23, 2019

Ø Issue Date: January 21, 2019

Ø Effectivity Date: April 21, 2019

Ø Description: Qualification of G700LA Mold Compound, Pure Sn Leadfinish and CuPdAu Wire for Select QFN Pb-Free Packages Assembled at ASE-KH