PCN190302 | Cypress Semiconductor
PCN190302
Last Updated:
Jan 23, 2019
Ø Issue Date: January 21, 2019
Ø Effectivity Date: April 21, 2019
Ø Description: Qualification of G700LA Mold Compound, Pure Sn Leadfinish and CuPdAu Wire for Select QFN Pb-Free Packages Assembled at ASE-KH
Related Files
| File Title | Language | Size | Last Updated |
|---|---|---|---|
 PCN190302 Affected Parts List.xls |
English | 74.5 KB | 01/23/2019 |
 PCN190302.zip |
English | 6.42 MB | 01/22/2019 |