PCN190302 | Cypress Semiconductor
PCN190302
Last Updated:
Apr 14, 2020
Ø Issue Date: January 21, 2019
Ø Effectivity Date: April 21, 2019
Ø Description: Qualification of G700LA Mold Compound, Pure Sn Leadfinish and CuPdAu Wire for Select QFN Pb-Free Packages Assembled at ASE-KH