PCN173802 | Cypress Semiconductor
PCN173802
Last Updated:
Apr 14, 2020
Ø Issue Date: September 19, 2017
Ø Effectivity Date: December 19, 2017
Ø Description: Qualification of G700LS Mold Compound and Roughened NiPdAu Leadframe for Select 8-Lead SOIC Commercial and Industrial Products Assembled at Amkor Philippines 1
Related Files
| File Title | Language | Size | Last Updated |
|---|---|---|---|
 PCN173802 Affected Parts List.xls |
English | 70 KB | 10/11/2017 |
 PCN173802.zip |
English | 2.87 MB | 09/21/2017 |