PCN171504 | Cypress Semiconductor
PCN171504
Last Updated:
Apr 14, 2020
Ø Issue Date: June 13, 2017
Ø Effectivity Date: October 13, 2017
Ø Description: Qualification of Sumitomo G700LS Mold Compound and Roughened NiPdAuLeadframe for 20 and 28-Lead SSOP Automotive Packages Assembled at Amkor Philippines 1
Related Files
| File Title | Language | Size | Last Updated |
|---|---|---|---|
 PCN171504 Affected Part List.xls |
English | 41 KB | 10/11/2017 |
 PCN171504.zip |
English | 2.52 MB | 07/24/2017 |