PCN145354 | Cypress Semiconductor
PCN145354
Last Updated:
Oct 24, 2017
Issue Date: December 19, 2014
Effectivity Date: March 19, 2015
Qualification of New Die Attach Epoxy and New Substrate Design for Select 48 Ball Grid Array (BGA) Packages.
Related Files
| File Title | Language | Size | Last Updated |
|---|---|---|---|
 PCN145354 Affected Part List.xls |
English | 28.5 KB | 10/24/2017 |
 PCN145354.zip |
English | 3.28 MB | 12/23/2014 |