PCN125145 | Cypress Semiconductor
PCN125145
Last Updated:
Oct 24, 2017
Issue Date: 3-Apr-12
Effectivity date: 1-Aug-12
Qualification of Copper Wire Bonds for Ball Grid Array (BGA) Products.
Related Files
| File Title | Language | Size | Last Updated |
|---|---|---|---|
 PCN125145 Affected Parts List.xls |
English | 100 KB | 10/24/2017 |
 PCN125145.zip |
English | 9.98 MB | 06/07/2012 |