PCN084672 | Cypress Semiconductor
PCN084672
Last Updated:
May 28, 2018
Qualification of 60 ball 8x20x1.2mm BGA SnPb solder ball packages assembled at Unisem Indonesia.
Issue Date: 10-Jun-2008
Effectivity Date: 1-Sep-2008
Qualification of 60 ball 8x20x1.2mm BGA SnPb solder ball packages assembled at Unisem Indonesia.
Issue Date: 10-Jun-2008
Effectivity Date: 1-Sep-2008