PCN084672 | Cypress Semiconductor
PCN084672
Last Updated:
May 28, 2018
Qualification of 60 ball 8x20x1.2mm BGA SnPb solder ball packages assembled at Unisem Indonesia.
Issue Date: 10-Jun-2008
Effectivity Date: 1-Sep-2008
Related Files
| File Title | Language | Size | Last Updated |
|---|---|---|---|
 PCN084672.zip |
English | 44.28 KB | 05/28/2018 |
 PCN084672 Affected Parts List.xls |
English | 25.5 KB | 10/13/2017 |