PCN084606 | Cypress Semiconductor
PCN084606
Last Updated:
May 28, 2018
Qualification of Xintec Taiwan as new assembly site for 70pin Wafer level chip scale
image sensor package with Shellcase Open-Cavity (OC) technology
Issue Date: 23-Jan-08
Effectivity Date: 01-Apr-08
Related Files
| File Title | Language | Size | Last Updated |
|---|---|---|---|
 PCN084606.zip |
English | 71.21 KB | 05/28/2018 |
 PCN084606 Affected Parts List.xls |
English | 26.5 KB | 10/13/2017 |