PCN074594 | Cypress Semiconductor
PCN074594
Last Updated:
May 28, 2018
Qualification of Advanced Interconnect Technologies (AIT), as an alternate assembly
site for 48 ball 7X7X1.2mm BGA Packages Using SnAgCu Solder Balls
Issue Date: 20-Dec-07
Effectivity Date: 01-Mar-08
Related Files
| File Title | Language | Size | Last Updated |
|---|---|---|---|
 PCN074594.zip |
English | 73.4 KB | 05/28/2018 |
 PCN074594 Affected Parts List.xls |
English | 26 KB | 10/13/2017 |