PCN074591 | Cypress Semiconductor
PCN074591
Last Updated:
May 28, 2018
Qualification of Advanced Interconnect Technologies (AIT), as an alternate assembly
site for 100 ball 11x11x1.4mm BGA Packages Using SnAgCu Solder Balls
Issue Date: 17-Dec-07
Effectivity Date: 01-Mar-08
Related Files
| File Title | Language | Size | Last Updated |
|---|---|---|---|
 PCN074591.zip |
English | 73.15 KB | 05/28/2018 |
 PCN074591 Affected Parts List.xls |
English | 26 KB | 10/13/2017 |