PCN074590 | Cypress Semiconductor
PCN074590
Last Updated:
May 28, 2018
Qualification of Advanced Interconnect Technologies (AIT), as an alternate assembly
site for 256 ball 17x17x1.7mm BGA Packages Using Sn98.5%Ag1%Cu0.5% Solder Balls
Issue Date: 17-Dec-07
Effectivity Date: 01-Feb-08