PCN074590 | Cypress Semiconductor
PCN074590
Last Updated:
May 28, 2018
Qualification of Advanced Interconnect Technologies (AIT), as an alternate assembly
site for 256 ball 17x17x1.7mm BGA Packages Using Sn98.5%Ag1%Cu0.5% Solder Balls
Issue Date: 17-Dec-07
Effectivity Date: 01-Feb-08
Related Files
| File Title | Language | Size | Last Updated |
|---|---|---|---|
 PCN074590.zip |
English | 74.49 KB | 05/28/2018 |
 PCN074590 Affected Parts List.xls |
English | 29.5 KB | 10/12/2017 |