PCN074585 | Cypress Semiconductor
PCN074585
Last Updated:
May 28, 2018
Qualification of Advanced Interconnect Technologies (AIT), as an alternate assembly
site for 60 ball 8x20x1.2mm BGA Packages Using SnAgCu Solder Balls
Issue Date: 05-Dec-07
Effectivity Date: 01-Mar-08
Related Files
| File Title | Language | Size | Last Updated |
|---|---|---|---|
 PCN074585.zip |
English | 73.13 KB | 05/28/2018 |
 PCN074585 Affected Parts List.xls |
English | 25.5 KB | 10/12/2017 |