PCN071531 | Cypress Semiconductor
PCN071531
Last Updated:
May 28, 2018
Qualification of KE-G2270/Kyocera Green mold compound and Ablestik 2025D Die
Attach for 48FBGA, Pb-Free package assembled at Advanced Semiconductor Engineering
(ASE-Taiwan)
Issue Date: 31-Jul-07
Effectivity Date: 31-Jul-07