PCN071531 | Cypress Semiconductor
PCN071531
Last Updated:
May 28, 2018
Qualification of KE-G2270/Kyocera Green mold compound and Ablestik 2025D Die
Attach for 48FBGA, Pb-Free package assembled at Advanced Semiconductor Engineering
(ASE-Taiwan)
Issue Date: 31-Jul-07
Effectivity Date: 31-Jul-07
Related Files
| File Title | Language | Size | Last Updated |
|---|---|---|---|
 PCN071531.zip |
English | 159.64 KB | 05/28/2018 |
 PCN071530 Affected Part List.xls |
English | 29.5 KB | 10/12/2017 |