PCN071516 | Cypress Semiconductor
PCN071516
Last Updated:
May 27, 2018
Qualification of Advanced Interconnect Technologies (AIT), as an alternate assembly
site for 165BGA 13x15x1.4mm Pb-Free Package with Sn98.5%Ag1%Cu0.5% Solder Ball
Finish
Issue Date: 09-Jun-07
Effectivity Date: 01-Aug-07
Related Files
| File Title | Language | Size | Last Updated |
|---|---|---|---|
 PCN071516.zip |
English | 156.92 KB | 05/27/2018 |
 PCN071516 Affected Parts List.xls |
English | 27.5 KB | 10/12/2017 |