PCN071386 | Cypress Semiconductor
PCN071386
Last Updated:
May 27, 2018
Qualification of KYOCERA Green Mold Compound for Small Shrink Outline Packages (SSOP) assembled at Cypress Manufacturing Limited (CML)
Issue Date: 21-Feb-07
Effectivity Date: 21-Feb-07
Related Files
| File Title | Language | Size | Last Updated |
|---|---|---|---|
 PCN071386.zip |
English | 300.67 KB | 05/27/2018 |
 PCN071386 Affected Parts List.xls |
English | 61 KB | 10/12/2017 |