PCN061327 | Cypress Semiconductor
PCN061327
Last Updated:
May 28, 2018
Qualification of KYOCERA KE-G3000DA Green Mold Compound for 20/24Leads QSOP package for standard, Pb-Free and Green package application assembled at Cypress Manufacturing Limited (CML).
Issue Date: 11/23/2006
Effectivity Date: 11/23/2006