PCN061327 | Cypress Semiconductor
PCN061327
Last Updated:
May 28, 2018
Qualification of KYOCERA KE-G3000DA Green Mold Compound for 20/24Leads QSOP package for standard, Pb-Free and Green package application assembled at Cypress Manufacturing Limited (CML).
Issue Date: 11/23/2006
Effectivity Date: 11/23/2006
Related Files
| File Title | Language | Size | Last Updated |
|---|---|---|---|
 PCN061327.zip |
English | 167.84 KB | 05/28/2018 |
 PCN061327 Affected Part List.xls |
English | 29 KB | 10/16/2017 |