PCN061003 | Cypress Semiconductor
PCN061003
Last Updated:
May 29, 2018
2M MoBLTM SRAM Process Technology Transition from R52LD-3 (0.25 micron) to R95LD-3R (90-nanometer), Lead-free package on 44 pin TSOP II (Thin Shrunk Outline Package), 36/48-ball VFBGA (Very Fine Ball Grid Array)
Issue Date: 28-Feb-2006
Effectivity Date: 9-May-2006
Related Files
| File Title | Language | Size | Last Updated |
|---|---|---|---|
 PCN061003.zip |
English | 334.12 KB | 05/29/2018 |
 PCN061003 Affected Parts List.xls |
English | 30 KB | 10/23/2017 |