PCN061003 | Cypress Semiconductor
PCN061003
Last Updated:
May 29, 2018
2M MoBLTM SRAM Process Technology Transition from R52LD-3 (0.25 micron) to R95LD-3R (90-nanometer), Lead-free package on 44 pin TSOP II (Thin Shrunk Outline Package), 36/48-ball VFBGA (Very Fine Ball Grid Array)
Issue Date: 28-Feb-2006
Effectivity Date: 9-May-2006