PCN050667 | Cypress Semiconductor
PCN050667
Last Updated:
May 27, 2018
Change of assembly materials for all FBGA packages built in Advance Semiconductor Engineering (ASE) -Taiwan.
Issue Date: 30-Jun-2005
Effectivity Date: sep-2005
Related Files
| File Title | Language | Size | Last Updated |
|---|---|---|---|
 PCN050667.zip |
English | 223.87 KB | 05/27/2018 |
 PCN050667 Affected Parts List.xls |
English | 59.5 KB | 10/13/2017 |