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IPC1752 MATERIAL DECLARATION SSOP48 (300 mil) (SP48)_CML_Au WIRE_NiPdAu_HEKEL QMI509_NITTO MP8500 | Cypress Semiconductor

IPC1752 MATERIAL DECLARATION SSOP48 (300 mil) (SP48)_CML_Au WIRE_NiPdAu_HEKEL QMI509_NITTO MP8500

Last Updated: 
Nov 01, 2019
Version: 
*A
IPC 1752 is the Standard for the exchange of materials declaration data developed by component manufacturers to standardize the material declaration based from Industry Standard requirements. The composition table were based from the Material Declaration Datasheet of the materials use on the product.

IPC-1752-2_v1.1_SSOP 48_CML_NiPdAu_Standard Mold Compound

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