IPC1752 MATERIAL DECLARATION SSOP28 (209 mil) (SP28)_CML_Au WIRE_NiPdAuAg_HENKEL QI509_KYOCERA KEG3000 | Cypress Semiconductor
IPC1752 MATERIAL DECLARATION SSOP28 (209 mil) (SP28)_CML_Au WIRE_NiPdAuAg_HENKEL QI509_KYOCERA KEG3000
Last Updated:
Apr 17, 2020
Version:
*C
IPC 1752 is the Standard for the exchange of materials declaration data developed by component manufacturers to standardize the material declaration based from
Industry Standard requirements. The composition table were based from the Material Declaration Datasheet of the materials use on the product.
Related Files
| File Title | Language | Size | Last Updated |
|---|---|---|---|
 IPC1752 MATERIAL DECLARATION SSOP28 (209 mil) (SP28)_CML_Au WIRE_NiPdAuAg_HENKEL QI509_KYOCERA KEG3000.pdf |
English | 346.29 KB | 04/16/2020 |