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IPC1752 MATERIAL DECLARATION SOIC24 (300 mil) (SZ24)_CML_Au WIRE_NiPdAu_HENKEL QMI509_KYOCERA KEG3000DA | Cypress Semiconductor

IPC1752 MATERIAL DECLARATION SOIC24 (300 mil) (SZ24)_CML_Au WIRE_NiPdAu_HENKEL QMI509_KYOCERA KEG3000DA

Last Updated: 
May 11, 2020
Version: 
*B
IPC 1752 is the Standard for the exchange of materials declaration data developed by component manufacturers to standardize the material declaration based from Industry Standard requirements. The composition table were based from the Material Declaration Datasheet of the materials use on the product.

IPC-1752-2_v1.1_SOIC 24_CML_NiPdAu_Green Mold Compound

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