IPC1752 MATERIAL DECLARATION SOIC20 (300 mil) (SZ20)_CML_Cu WIRE_NiPdAu_HENKEL QMI509_KYOCERA G3000DA | Cypress Semiconductor
IPC1752 MATERIAL DECLARATION SOIC20 (300 mil) (SZ20)_CML_Cu WIRE_NiPdAu_HENKEL QMI509_KYOCERA G3000DA
Last Updated:
May 21, 2020
Version:
*B
IPC 1752 is the Standard for the exchange of materials declaration data developed by component manufacturers to standardize the material declaration based from
Industry Standard requirements. The composition table were based from the Material Declaration Datasheet of the materials use on the product.
Related Files
| File Title | Language | Size | Last Updated |
|---|---|---|---|
 IPC1752 MATERIAL DECLARATION SOIC20 (300 mil) (SZ20)_CML_Cu WIRE_NiPdAu_HENKEL QMI509_KYOCERA G3000DA.pdf |
English | 351.89 KB | 04/14/2020 |