IPC1752 MATERIAL DECLARATION SOIC8 (208 mil) (SOC008)_ZKT_CuPd WIRE_PURE Sn_YIZBOND 8511_SAMSUNG SG8300HKT | Cypress Semiconductor
IPC1752 MATERIAL DECLARATION SOIC8 (208 mil) (SOC008)_ZKT_CuPd WIRE_PURE Sn_YIZBOND 8511_SAMSUNG SG8300HKT
Last Updated:
Aug 21, 2020
Version:
*A
IPC 1752 is the Standard for the exchange of materials declaration data developed by component manufacturers to standardize the material declaration based from
Industry Standard requirements. The composition table were based from the Material Declaration Datasheet of the materials use on the product.
Related Files
| File Title | Language | Size | Last Updated |
|---|---|---|---|
 IPC1752 MATERIAL DECLARATION SOIC8 (208 mil) (SOC008)_ZKT_CuPd WIRE_PURE Sn_YIZBOND 8511_SAMSUNG SG8300HKT.pdf |
English | 283.28 KB | 08/21/2020 |