IPC1752 MATERIAL DECLARATION BGA165 (15 X 17 mm) (BW165)_ASEK_Au WIRE_SnAgCu(SAC405)_HENKEL 20205D_KYOCERA KEG2270 | Cypress Semiconductor
IPC1752 MATERIAL DECLARATION BGA165 (15 X 17 mm) (BW165)_ASEK_Au WIRE_SnAgCu(SAC405)_HENKEL 20205D_KYOCERA KEG2270
Last Updated:
Apr 07, 2021
Version:
*B
IPC 1752 is the Standard for the exchange of materials declaration data developed by component manufacturers to standardize the material declaration based from
Industry Standard requirements. The composition table were based from the Material Declaration Datasheet of the materials use on the product.
IPC-1752-2_v1.1_BGA165_(15x17)_ASE
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Related Files
| File Title | Language | Size | Last Updated |
|---|---|---|---|
 IPC1752 MATERIAL DECLARATION BGA165 (15 X 17 mm) (BW165)_ASEK_Au WIRE_SnAgCu(SAC405)_HENKEL 20205D_KYOCERA KEG2270.pdf |
English | 247.88 KB | 04/06/2021 |