IPC-1752-2_V1.1_361L FLIP CHIP BGA (21 X 21 X 2.5 MM)_ASE TAIWAN | Cypress Semiconductor
IPC-1752-2_V1.1_361L FLIP CHIP BGA (21 X 21 X 2.5 MM)_ASE TAIWAN
Oct 30, 2019
IPC 1752 is the Standard for the exchange of materials declaration data developed by component manufacturers to standardize the material declaration based from Industry Standard requirements. The composition table were based from the Material Declaration Datasheet of the materials use on the product.