IPC-1752-2_V1.1_361L FLIP CHIP BGA (21 X 21 X 2.5 MM)_ASE TAIWAN | Cypress Semiconductor
IPC-1752-2_V1.1_361L FLIP CHIP BGA (21 X 21 X 2.5 MM)_ASE TAIWAN
Last Updated:
Oct 30, 2019
Version:
*A
IPC 1752 is the Standard for the exchange of materials declaration data developed by component manufacturers to standardize the material declaration based from Industry Standard requirements. The composition table were based from the Material Declaration Datasheet of the materials use on the product.
Related Files
| File Title | Language | Size | Last Updated |
|---|---|---|---|
 IPC1752 MATERIAL DECLARATION FLIP CHIP BGA361 (21X21X2.5 mm) (FR361)_ASEK_Au Wire_SnAgCu(SAC305).pdf |
English | 408.07 KB | 10/30/2019 |