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BCM2073XS SiP Module: BCM20737L - Bluetooth Low Energy System in Package (SiP) Module | Cypress Semiconductor

BCM2073XS SiP Module: BCM20737L - Bluetooth Low Energy System in Package (SiP) Module

Last Updated: 
Jun 03, 2020
Version: 
*C

The Cypress CYW20737L is a compact, highly integrated Bluetooth Low Energy (BLE) system-in-package (SiP) module. The device includes an embedded BLE antenna, 24 MHz clock, and 512 Kb EEPROM, so a minimal set of external components is needed to create a standalone BLE device. The CYW20737L accelerates time to market. The Bluetooth stack and several application profiles are built into the module, allowing customers to focus on their core applications. To further reduce application development time, the CYW20737L includes integrated software support, with one-click installation of the complete environment and a one-click compile/build/link/load cycle. Coupled with an ultrasmall form factor and support for a wide voltage range, the CYW20737L is ideal for any BT Smart application.

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