512 MBIT HYPERFLASH™ + 64 MBIT HYPERRAM™ 3V Multi-Chip Package (MCP) Datasheet | Cypress Semiconductor
512 MBIT HYPERFLASH™ + 64 MBIT HYPERRAM™ 3V Multi-Chip Package (MCP) Datasheet
Last Updated:
Apr 28, 2017
Version:
*D
For systems needing both Flash and self-refresh DRAM, the HyperBus products family includes MCP devices that combine HyperFlash and HyperRAM in a single package. A HyperBus MCP reduces board space and Printed Circuit Board (PCB) signal routing congestion while also maintaining or improving signal integrity over separately packaged memory configurations.