512 MBIT HYPERFLASH™ + 64 MBIT HYPERRAM™ 3V Multi-Chip Package (MCP) Datasheet | Cypress Semiconductor
512 MBIT HYPERFLASH™ + 64 MBIT HYPERRAM™ 3V Multi-Chip Package (MCP) Datasheet
For systems needing both Flash and self-refresh DRAM, the HyperBus products family includes MCP devices that combine HyperFlash and HyperRAM in a single package. A HyperBus MCP reduces board space and Printed Circuit Board (PCB) signal routing congestion while also maintaining or improving signal integrity over separately packaged memory configurations.
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Related Files
| File Title | Language | Size | Last Updated |
|---|---|---|---|
 512 MBIT HYPERFLASH + 64 MBIT HYPERRAM 3V MCP Datasheet.pdf |
English | 1.1 MB | 04/28/2017 |