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AN98554 - Cypress, Micron, and Winbond High Density 3.0 Volt SPI Flash Core Command Sets | Cypress Semiconductor

AN98554 - Cypress, Micron, and Winbond High Density 3.0 Volt SPI Flash Core Command Sets

Last Updated: 
Apr 25, 2018
Version: 
*C
AN98554 discusses the differences of the core command sets Cypress’s high-density, 3.0-V SPI flash devices with 128 Mbit or higher densities with devices from Micron and Winbond.