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AN79938 - Design Guidelines for Cypress Ball Grid Array (BGA) Packaged Devices | Cypress Semiconductor

AN79938 - Design Guidelines for Cypress Ball Grid Array (BGA) Packaged Devices

Last Updated: 
May 04, 2017
Version: 
*E

AN79938 provides guidelines for designing, manufacturing, and handling Cypress's ball grid array (BGA) packages on printed circuit boards. This application note is for engineers who design and develop surface mount technology (SMT), printed circuit boards (PCB), or flexible printed circuits (FPC) for ball grid array (BGA) packaged devices.

These guidelines document the best practices for PCB/FPC design and assembly when using BGA-packaged devices. Because many factors influence manufacturing, performance, and reliability, validate these guidelines using your own product development and qualification processes. The following are the major influencing factors:

  • PCB/FPC and solder/flux material
  • Manufacturing equipment
  • Application-specific requirements

Dear valued customer,

Thank you for choosing our products. They come with all the know-how and passion that our engineers have put into it. As you probably already know, Cypress is now Infineon. This is a major step for our company, but also for the good of you. 

Reliability and business continuity are of utmost importance for us. Hence, we remain fully committed to honoring existing customer and distributor relationships. This includes offering the legacy Cypress product portfolio. We thank you very much for your trusting support.

For the full version of this message, please download the PDF version.

Translated documents are for reference only. We recommend that you refer to the English-language version of a document if you are engaged in development of a design.