MoBL-USB TX3LP18 photo | Cypress Semiconductor
MoBL-USB TX3LP18 photo
Cypress's new MoBL-USB™ TX3LP18 high-speed USB 2.0 transceiver is available in the industry's smallest package. The 20-pin WLCSP (Wafer Level Chip Scale Package) package measures only 2.2 mm x 1.8 mm - almost three times smaller than a standard golf ball dimple. In addition to having a footprint 20 percent smaller than any competitive solutions, the device offers ultra-low power consumption. This combination saves board space and prolongs battery-life for a wide range of portable applications such as mobile handsets, PDAs, PMPs, and GPS units.
The MoBL-USB TX3LP18 transceiver is compliant with the ULPI standard and delivers ultra-low power consumption with a 0.5 uA nominal sleep mode. In addition to its small size, the device integrates multiple passive components in order to further reduce boardspace usage and enable smaller end systems. It removes the need for a dedicated 3.3V power supply with a wide input supply voltage range from 3.0 to 5.8V, and features an integrated Phase-Locked Loop (PLL) to supply USB clocking requirements without a dedicated crystal.
Click the link above to download a high-resolution image of the MoBL-USB TX3LP18 transceiver.