Wafer & Die | Cypress Semiconductors
Wafer & Die
Cypress's package memory products are sold in both wafer and die form. They are classified as follows:
Wafers are probed at room and hot temperatures to guarantee full functionality. Other parameters are guaranteed based on the level of product that is supplied to the customer.
Known-Good Die (KGD)
KGD is available in both die-in-wafer form and backgrind die. Thickness of product in wafer form is about 25 mils to 30 mils. Thickness of Backgrind die is 11 mils or 14 mils. They are sawed, and shipped as wafers or in waffle packs.