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F-RAM and nvSRAM Wafer and Die Support | Cypress Semiconductor

F-RAM and nvSRAM Wafer and Die Support

Cypress’s NVRAM products combine high performance with instant nonvolatile data storage on power loss. They simplify design by eliminating the need for external batteries or super capacitors for data storage.

F-RAM wafer and die support:

The ferroelectric material in the F-RAM memory cells is highly resistant to influence by radiation and magnetic field exposure, providing soft error rate immunity and making it a superior alternative to MRAM. Cypress supports both wafer and die parts for customers on a need basis. Standard wafer parts from 256Kb to 2Mb are available for ordering.

nvSRAM wafer and die support:

Cypress’s parallel nvSRAM products are the industry’s fastest parallel nonvolatile RAM solutions with as low as 20 ns access times. They provide unlimited endurance and are ideal for rugged usage where customers need data storage with no additional battery use. Standard wafer parts from 64Kb to 16Mb are available for ordering.


Attribute Wafer and Die Features
Technology F-RAM and nvSRAM
Density 64Kb - 16Mb
Interface SPI
Parallel (x8, x16, x32)
Max Frequency Up to 40 MHz (SPI)
Up to 3.4 MHz (I2C)
Access Time Up to 20 ns (Parallel)
Voltage Range 2.0 – 3.6 V
2.7 – 3.65 V
2.7 – 5.5 V
4.5 – 5.5 V
Temperature Range -40˚C to +85˚C
-40˚C to +105˚C
-40˚C to +125˚C
Package Wafer and Die support