The Cypress HyperFlash and HyperRAM MCP combine a high-speed, NOR flash memory for fast-boot, instant-on capability with a self-refresh DRAM for expanded scratchpad memory in a reduced footprint and low-pin-count package. This complete NOR Flash/DRAM memory subsystem based on the Cypress HyperBus™ interface is the ideal solution for space-constrained and cost-optimized IoT and embedded designs.
HyperFlash and HyperRAM operate on the same low-pin-count HyperBus reducing pin count by 70% compared to competing SDRAM and Quad SPI solutions.
A single, 48mm2 24-Ball BGA enables an 77% space savings compared to existing SDRAM and Quad SPI memory solutions.
A common pinout with HyperFlash and HyperRAM discrete devices enables a single PCB layout that supports HyperFlash, HyperRAM or HyperFlash and HyperRAM in any combination.
The HyperFlash and HyperRAM MCP is the ideal solution for a wide range of embedded applications like automotive clusters and infotainment, communication equipment, industrial applications, and high-performance consumer products. The MCP is offered in the industrial (-40°C to +85°C) and industrial-plus (-40°C to +105°C) temperature ranges. Both temperature ranges are also available with AEC‑Q100 qualification and PPAP support.