SL811HST-AXC | Cypress Semiconductor

You are here

SL811HST-AXC
Status: In Production

Datasheet

(pdf, 339.84 KB) RoHS PB Free

SL811HST-AXC

Development KitN/A
ApplicationUSB Embedded Hosts
Automotive QualifiedN
CPU CoreCY16
Data TransfersBulk, Interrupt, Isochronous
Host Ports0
I/O OptionsN/A
Max. Operating Temp. (°C)70
Max. Operating Voltage (V)3.45
Memory ArchitectureROM/RAM
Memory Size (KB)256
Min. Operating Temp. (°C)0
Min. Operating Voltage (V)3.00
No. of Endpoints4
No. of I/Os8
Software ToolsN/A
Tape & ReelN

Pricing & Inventory Availability

1-9 unit Price* 10-24 unit Price* 25-99 unit Price* 100-249 unit Price* 250-999 unit Price* 1000+ unit Price*
$15.25 $13.17 $12.47 $10.40 $10.09 $9.39
Availability Quantity Ships In Buy from Cypress Buy from Distributors
In Stock 150 24-48 hours

Packaging/Ordering

Package
No. of Pins
48
Package Dimensions
275 L x 1.4 H x 275 W (Mils)
Package Cross Section Drawing
Package Carrier
TRAY
Standard Pack Quantity
1250
Minimum Order Quantity (MOQ)
1250
Order Increment
1250
Estimated Lead Time (days)
126
HTS Code
8542.31.0001
ECCN
(A.3)
ECCN Suball
3A991

Quality and RoHS

Moisture Sensitivity Level (MSL)
Peak Reflow Temp. (°C)
PB Free
Y
Lead/Ball Finish
N/A

Technical Documents

Application Notes (2)

Development Kits/Boards (1)

Product Change Notice (PCN) (3)

May 28, 2018
Qualification of Pb-Free 100% Pure Tin Lead Finish for SL811HST-AXC Device
Oct 25, 2017
Change in Qualification of Copper Wire Bonds for 56SSOP Products at OSE-Taiwan
Oct 24, 2017
Qualification of Copper Wire Bonds for select Lead Frame (LF) Products