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SL811HST-AXC | Cypress Semiconductor

SL811HST-AXC

Status: In Production

Datasheet

(pdf, 373.08 KB) RoHS PB Free
Datasheet updated: November 23, 2015

SL811HST-AXC

Development KitN/A
ApplicationUSB Embedded Hosts
Automotive QualifiedN
CPU CoreCY16
Data TransfersBulk, Interrupt, Isochronous
I/O OptionsN/A
Max. Operating Temp. (°C)70
Max. Operating Voltage (V)3.45
Memory ArchitectureROM/RAM
Memory Size (KB)256
Min. Operating Temp. (°C)0
Min. Operating Voltage (V)3.00
No. of I/Os8
Tape & ReelN

Pricing & Inventory Availability

1-9 unit Price* 10-24 unit Price* 25-99 unit Price* 100-249 unit Price* 250-999 unit Price* 1000+ unit Price*
$15.25 $13.17 $12.47 $10.40 $10.09 $9.39
Availability Quantity Ships In Order Now
Out of Stock 0 Please click here to check lead times

Packaging/Ordering

Package
No. of Pins
48
Package Dimensions
275 L x 1.4 H x 275 W (Mils)
Package Cross Section Drawing
Package Carrier
TRAY
Standard Pack Quantity
1250
Minimum Order Quantity (MOQ)
1250
Order Increment
1250
Estimated Lead Time (days)
91
HTS Code
8542.31.0000
ECCN
(A.3)
ECCN Suball
3A991

Quality and RoHS

Moisture Sensitivity Level (MSL)
Peak Reflow Temp. (°C)
PB Free
Y
Lead/Ball Finish
N/A

Package Material Declaration

Technical Documents

Development Kits/Boards (1)

Product Change Notice (PCN) (3)

Feb 10, 2016
Qualification of Pb-Free 100% Pure Tin Lead Finish for SL811HST-AXC Device
Feb 08, 2016
Qualification of Copper Wire Bonds for select Lead Frame (LF) Products
Feb 08, 2016
Change in Qualification of Copper Wire Bonds for 56SSOP Products at OSE-Taiwan