CYWB0224ABS-BVXI | Cypress Semiconductor

You are here

CYWB0224ABS-BVXI
Status: In Production

Datasheet

(pdf, 1.53 MB) RoHS PB Free

CYWB0224ABS-BVXI

Development KitCYWBDVK002AB
Automotive QualifiedN
Clock Input Frequency (MHz)19.2, 24, 26, 48
Interfaces SupportedHS-USB, SD/MMC+
Max. Operating Temp. (°C)85
Max. Operating Voltage (V)3.30
Min. Operating Temp. (°C)-40
Min. Operating Voltage (V)1.80
Tape & ReelN

Pricing & Inventory Availability

1-9 unit Price* 10-24 unit Price* 25-99 unit Price* 100-249 unit Price* 250-999 unit Price* 1000+ unit Price*
$13.19 $11.39 $10.79 $8.99 $8.72 $8.13
Availability Quantity Ships In Buy from Cypress Buy from Distributors
Out of Stock 0 Please click here to check lead times

Packaging/Ordering

Package
BGA
No. of Pins
100
Package Dimensions
236 L x 1 H x 236 W (Mils)
Package Weight
72.92 (mgs)
Package Cross Section Drawing
Package Carrier
TRAY
Package Carrier Drawing / Orientation
Standard Pack Quantity
429
Minimum Order Quantity (MOQ)
429
Order Increment
429
Estimated Lead Time (days)
91
HTS Code
8542.31.0001
ECCN
(A.3)
ECCN Suball
3A991

Quality and RoHS

Moisture Sensitivity Level (MSL)
3
Peak Reflow Temp. (°C)
PB Free
Y
Lead/Ball Finish
Sn/Ag/Cu

Package Material Declaration

RoHS Analysis Certificates (CoA) for Direct Materials

Please click here

Device Qualification Reports

FIT/MTBF, ESD (HBM/CDM) and Latch-up data available in the Device Qualification Report.

Technical Documents

Application Notes (3)

Product Change Notice (PCN) (3)

Oct 31, 2017
Q2, 2012 - Q4, 2013 Horizon Report
Oct 30, 2017
Q1, 2012 - Q2, 2013 Horizon Report
Oct 24, 2017
Qualification of Copper Wire Bonds for Ball Grid Array (BGA) Products

Product Information Notice (PIN) (2)

Nov 06, 2017
GSMC Merger with HH-NEC to Form HHGrace Semiconductor Manufacturing Corporation
Nov 06, 2017
Changes to Cypress Address Labels

Technical Articles (3)