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CYV15G0101DXB-BBXC | Cypress Semiconductor

CYV15G0101DXB-BBXC

Status: In Production

Datasheet

CYV15G0101DXB-BBXC

8B / 10B ENDECY
Automotive QualifiedN
FunctionsSERDES
Max. Operating Temp. (°C)70
Max. Operating Voltage (V)3.45
Max. Speed (Mbps)1500
Min. Operating Temp. (°C)0
Min. Operating Voltage (V)3.15
Min. Speed (Mbps)143
No. of Channels1
StandardSMPTE / DVBASI
Tape & ReelN

Pricing & Inventory Availability

1-9 unit Price* 10-24 unit Price* 25-99 unit Price* 100-249 unit Price* 250-999 unit Price* 1000+ unit Price*
$47.57 $45.57 $43.58 $41.58 $39.58 $36.26
Availability Quantity Ships In Order Now
Out of Stock 0 Please click here to check lead times

Packaging/Ordering

Package
BGA
No. of Pins
100
Package Dimensions
435 L x 1.4 H x 435 W (Mils)
Package Weight
266.60 (mgs)
Package Cross Section Drawing
Package Carrier
TRAY
Package Carrier Drawing / Orientation
Standard Pack Quantity
176
Minimum Order Quantity (MOQ)
176
Order Increment
176
Estimated Lead Time (days)
63
HTS Code
8542.39.0000
ECCN
B.1
ECCN Suball
5A991

Quality and RoHS

Moisture Sensitivity Level (MSL)
3
Peak Reflow Temp. (°C)
PB Free
Y
Lead/Ball Finish
Sn/Ag/Cu

Package Material Declaration

RoHS Analysis Certificates (CoA) for Direct Materials

Please click here

Technical Documents

Development Kits/Boards (2)

Feb 08, 2012
Feb 08, 2012

Software and Drivers (1)

Product Change Notice (PCN) (6)

Feb 10, 2016
Qualification of Advanced Interconnect Technologies (AIT), as an alternate assembly site for 100 ball 11x11x1.4mm BGA Packages Using SnAgCu Solder Balls
Feb 10, 2016
Improve Moisture Sensitivity Level of FBGA Pb-Free Products
Feb 10, 2016
Shipping Label Upgrade
Feb 08, 2016
Qualification of Copper Wire Bonds for Ball Grid Array (BGA) Products
Feb 07, 2016
Q1, 2012 - Q2, 2013 Horizon Report
Oct 04, 2012
Q2, 2012 - Q4, 2013 Horizon Report

Product Information Notice (PIN) (1)

Feb 05, 2016
Changes to Cypress Address Labels

IBIS (1)

Apr 07, 2010