CYUSB3014-BZXI | Cypress Semiconductor

CYUSB3014-BZXI
Status: In Production

Datasheet

(pdf, 570.83 KB) RoHS PB Free
(pdf, 481.91 KB) RoHS PB Free
(pdf, 848.27 KB) RoHS PB Free

CYUSB3014-BZXI

Development KitCYUSB3KIT-001
ApplicationUSB SuperSpeed Peripherals
Automotive QualifiedN
CPU CoreARM926 EJ-S
Data TransfersBulk, Interrupt, Isochronous
I/O Options8/16/32-bit GPIF, DMA, GPIO, I2C, UART, I2S, SPI
Max. Operating Temp. (°C)85
Max. Operating Voltage (V)1.25
Memory ArchitectureSRAM
Memory Size (KB)512
Min. Operating Temp. (°C)-40
Min. Operating Voltage (V)1.15
No. of Endpoints32
No. of I/Os60
Software ToolsEZ-USB FX3 SDK and GPIF II Designer
Tape & ReelN

Pricing & Inventory Availability

1-9 unit Price* 10-24 unit Price* 25-99 unit Price* 100-249 unit Price* 250-999 unit Price* 1000+ unit Price*
$35.46 $28.83 $27.46 $26.31 $25.85 $24.02
Availability Quantity Ships In Buy from Cypress Buy from Distributors
In Stock 685 24-48 hours

Packaging/Ordering

No. of Pins
121
Package Cross Section Drawing
Package Carrier
TRAY
Package Carrier Drawing / Orientation
Standard Pack Quantity
168
Minimum Order Quantity (MOQ)
168
Order Increment
168
Estimated Lead Time (days)
91
HTS Code
8542.31.0001
ECCN
(A.3)
ECCN Suball
3A991

Quality and RoHS

Moisture Sensitivity Level (MSL)
3
Peak Reflow Temp. (°C)
PB Free
Y
Lead/Ball Finish
Sn/Ag/Cu

RoHS Analysis Certificates (CoA) for Direct Materials

Please click here

Device Qualification Reports

FIT/MTBF, ESD (HBM/CDM) and Latch-up data available in the Device Qualification Report.

Technical Documents

Technical Reference Manuals (1)

Application Notes (12)

Product Change Notice (PCN) (8)

Nov 09, 2017
Planned Qualification of Spansion Manufacturing Sites for Cypress Products
Oct 31, 2017
Q2, 2012 - Q4, 2013 Horizon Report
Oct 30, 2017
Q1, 2012 - Q2, 2013 Horizon Report
Oct 24, 2017
Qualification of 65nm products without Nitride Seal Mask (NSM)
Oct 24, 2017
Qualification of ASE Taiwan as an additional assembly site for 121 Ball Grid Array (BGA) packaged products
Oct 24, 2017
Qualification of Copper Wire Bonds for Ball Grid Array (BGA) Products
Oct 12, 2017
PCN162502
Oct 11, 2017

Product Information Notice (PIN) (2)

Nov 06, 2017
Changes to Cypress Address Labels
Oct 26, 2017
Application Work around for undefined VID in FX3

IBIS (1)