CYUSB3014-BZXI | Cypress Semiconductor

CYUSB3014-BZXI

Status: In Production

Datasheet

(pdf, 4.71 MB) RoHS PB Free
Datasheet updated: August 23, 2016
(pdf, 848.27 KB) RoHS PB Free
Datasheet updated: August 23, 2016
(pdf, 481.91 KB) RoHS PB Free
Datasheet updated: August 23, 2016

CYUSB3014-BZXI

Development KitCYUSB3KIT-001
ApplicationUSB SuperSpeed Peripherals
Automotive QualifiedN
CPU CoreARM926 EJ-S
Data TransfersBulk, Interrupt, Isochronous
I/O Options8/16/32-bit GPIF, DMA, GPIO, I2C, UART, I2S, SPI
Max. Operating Temp. (°C)85
Max. Operating Voltage (V)1.25
Memory ArchitectureSRAM
Memory Size (KB)512
Min. Operating Temp. (°C)-40
Min. Operating Voltage (V)1.15
No. of I/Os60
Tape & ReelN

Pricing & Inventory Availability

1-9 unit Price* 10-24 unit Price* 25-99 unit Price* 100-249 unit Price* 250-999 unit Price* 1000+ unit Price*
$35.46 $28.83 $27.46 $26.31 $25.85 $24.02
Availability Quantity Ships In Order Now
In Stock 2 910 24-48 hours

Packaging/Ordering

No. of Pins
121
Package Cross Section Drawing
Package Carrier
TRAY
Package Carrier Drawing / Orientation
Standard Pack Quantity
168
Minimum Order Quantity (MOQ)
168
Order Increment
168
Estimated Lead Time (days)
42
HTS Code
8542.31.0000
ECCN
(A.3)
ECCN Suball
3A991

Quality and RoHS

Moisture Sensitivity Level (MSL)
3
Peak Reflow Temp. (°C)
PB Free
Y
Lead/Ball Finish
Sn/Ag/Cu

RoHS Analysis Certificates (CoA) for Direct Materials

Please click here

Device Qualification Reports

FIT/MTBF, ESD (HBM/CDM) and Latch-up data available in the Device Qualification Report.

Technical Documents

Technical Reference Manuals (1)

Product Change Notice (PCN) (7)

Jul 01, 2016
PCN162502
Feb 08, 2016
Qualification of Copper Wire Bonds for Ball Grid Array (BGA) Products
Feb 08, 2016
Qualification of ASE Taiwan as an additional assembly site for 121 Ball Grid Array (BGA) packaged products
Feb 08, 2016
Qualification of 65nm products without Nitride Seal Mask (NSM)
Feb 07, 2016
Planned Qualification of Spansion Manufacturing Sites for Cypress Products
Feb 07, 2016
Q1, 2012 - Q2, 2013 Horizon Report
Oct 04, 2012
Q2, 2012 - Q4, 2013 Horizon Report

Product Information Notice (PIN) (3)

Feb 05, 2016
Application Work around for undefined VID in FX3
Feb 05, 2016
Barcode Inclusion on Cypress Packing List
Feb 05, 2016
Changes to Cypress Address Labels

IBIS (1)