CYDM256B16-55BVXI | Cypress Semiconductor

You are here

CYDM256B16-55BVXI
Status: In Production

Datasheet

(pdf, 773 KB) RoHS PB Free

CYDM256B16-55BVXI

Automotive QualifiedN
Bus Width (bits)16
Density (Kb)256
Depth (K)16
Interface TypeSRAM only
Max. Operating Temp. (°C)85
Max. Operating Voltage (V)3.30
Min. Operating Temp. (°C)-40
Min. Operating Voltage (V)1.80
Speed (ns)55
Tape & ReelN
TypeAsynchronous

Pricing & Inventory Availability

1-9 unit Price* 10-24 unit Price* 25-99 unit Price* 100-249 unit Price* 250-999 unit Price* 1000+ unit Price*
$12.32 $10.64 $10.08 $8.40 $8.15 $7.59
Availability Quantity Ships In Buy from Cypress Buy from Distributors
Out of Stock 0 Please click here to check lead times

Packaging/Ordering

Package
BGA
No. of Pins
100
Package Dimensions
236 L x 1 H x 236 W (Mils)
Package Weight
72.92 (mgs)
Package Cross Section Drawing
Package Carrier
TRAY
Package Carrier Drawing / Orientation
Standard Pack Quantity
429
Minimum Order Quantity (MOQ)
429
Order Increment
429
Estimated Lead Time (days)
42
HTS Code
8542.32.0041
ECCN
None
ECCN Suball
EAR99

Quality and RoHS

Moisture Sensitivity Level (MSL)
3
Peak Reflow Temp. (°C)
PB Free
Y
Lead/Ball Finish
Sn/Ag/Cu

Package Material Declaration

RoHS Analysis Certificates (CoA) for Direct Materials

Please click here

Technical Documents

Product Change Notice (PCN) (7)

Oct 31, 2017
Q2, 2012 - Q4, 2013 Horizon Report
Oct 30, 2017
Q1, 2012 - Q2, 2013 Horizon Report
Oct 24, 2017
Qualification of Copper Wire Bonds for Ball Grid Array (BGA) Products
Oct 18, 2017
Qualification of Sn (98.5%)/Ag (1.0%)/Cu (0.5%) Solder Ball Composition for 6x8x1.0mm, 8x9.5x1.0mm, 6x6x1.0mm, and 5x5x1.0mm VFBGA packages assembled at ASE-Taiwan
Oct 16, 2017
Shipping Label Upgrade
Oct 12, 2017
Qualification of Cypress Manufacturing Limited as an Additional Assembly Site for 56 Ball 5X5X1.0MM and 100 Ball 6X6X1.0MM VFBGA Packages
Oct 12, 2017
Qualification of Advanced Interconnect Technologies (AIT), as an alternate assembly site for 100BGA 6x6x1.0mm Pb-Free Package with Sn98.5%Ag1%Cu0.5% Solder Ball Finish

Product Information Notice (PIN) (1)

Nov 06, 2017
Changes to Cypress Address Labels

Technical Articles (1)