CYD18S18V18-200BBAXI | Cypress Semiconductor

CYD18S18V18-200BBAXI
Status: In Production

Datasheet

(pdf, 738.87 KB) RoHS PB Free
(pdf, 877.41 KB) RoHS PB Free
(pdf, 867.1 KB) RoHS PB Free

CYD18S18V18-200BBAXI

Automotive QualifiedN
Density (Kb)18432
Frequency (MHz)200
Max. Operating Temp. (°C)85
Max. Operating VCCQ (V)1.90
Max. Operating Voltage (V)1.90
Min. Operating Temp. (°C)-40
Min. Operating VCCQ (V)1.70
Min. Operating Voltage (V)1.70
Organization (X x Y)1Mb x 18
Part FamilyFullflex Sync Dual Ports
Speed (ns)0
Tape & ReelN
Temp. ClassificationIndustrial

Pricing & Inventory Availability

1-9 unit Price* 10-24 unit Price* 25-99 unit Price* 100-249 unit Price* 250-999 unit Price* 1000+ unit Price*
$248.96 $210.06 $205.39 $199.17 $197.61 $194.50
Availability Quantity Ships In Buy from Cypress Buy from Distributors
Out of Stock 0 Please click here to check lead times

Packaging/Ordering

Package
No. of Pins
256
Package Dimensions
669 L x 1.7 H x 669 W (Mils)
Package Weight
866.48 (mgs)
Package Cross Section Drawing
Package Carrier
TRAY
Package Carrier Drawing / Orientation
Standard Pack Quantity
90
Minimum Order Quantity (MOQ)
90
Order Increment
90
Estimated Lead Time (days)
56
HTS Code
8542.32.0040
ECCN
(B.2.B.)
ECCN Suball
3A991

Quality and RoHS

Moisture Sensitivity Level (MSL)
3
Peak Reflow Temp. (°C)
PB Free
Y
Lead/Ball Finish
Sn/Ag/Cu

Package Material Declaration

Last Update: Nov 23, 2016

IPC 1752 Material Declaration

RoHS Analysis Certificates (CoA) for Direct Materials

Please click here

Device Qualification Reports

FIT/MTBF, ESD (HBM/CDM) and Latch-up data available in the Device Qualification Report.

Last Update: Sep 17, 2016

Technical Documents

Product Change Notice (PCN) (1)

Feb 10, 2016
Qualification of Advanced Interconnect Technologies (AIT), as an alternate assembly site for 256 ball 17x17x1.7mm BGA Packages Using Sn98.5%Ag1%Cu0.5% Solder Balls

Product Information Notice (PIN) (1)

Feb 05, 2016
Changes to Cypress Address Labels

IBIS (1)

BSDL (1)

Verilog (1)

VHDL (1)