CYD09S36V18-200BBXC | Cypress Semiconductor

CYD09S36V18-200BBXC
Status: Obsolete

CYD09S36V18-200BBXC

Automotive QualifiedN
Density (Kb)9216
Frequency (MHz)200
Max. Operating Temp. (°C)70
Max. Operating VCCQ (V)1.90
Max. Operating Voltage (V)1.90
Min. Operating Temp. (°C)0
Min. Operating VCCQ (V)1.70
Min. Operating Voltage (V)1.70
Organization (X x Y)256Kb x 36
Speed (ns)0
Tape & ReelN
Temp. ClassificationCommercial

Pricing & Inventory Availability

1-9 unit Price* 10-24 unit Price* 25-99 unit Price* 100-249 unit Price* 250-999 unit Price* 1000+ unit Price*
$161.87 $137.34 $134.40 $130.47 $128.51 $125.57
Availability Quantity Ships In Buy from Cypress Buy from Distributors
Out of Stock 0 Please click here to check lead times

Packaging/Ordering

Package
No. of Pins
256
Package Dimensions
669 L x 1.7 H x 669 W (Mils)
Package Weight
866.48 (mgs)
Package Cross Section Drawing
Package Carrier
TRAY
Package Carrier Drawing / Orientation
Standard Pack Quantity
90
Minimum Order Quantity (MOQ)
90
Order Increment
90
Estimated Lead Time (days)
91
HTS Code
8542.32.0041
ECCN
(B.2.B.)
ECCN Suball
3A991

Quality and RoHS

Moisture Sensitivity Level (MSL)
3
Peak Reflow Temp. (°C)
PB Free
Y
Lead/Ball Finish
Sn/Ag/Cu

Package Material Declaration

Last Update: Nov 23, 2016

IPC 1752 Material Declaration

RoHS Analysis Certificates (CoA) for Direct Materials

Please click here

Technical Documents

Product Change Notice (PCN) (2)

Oct 17, 2017
Changes to Minimum Order Quantity (MOQ) and Order Increment (OI) values on various Cypress Products
Oct 12, 2017
Qualification of Advanced Interconnect Technologies (AIT), as an alternate assembly site for 256 ball 17x17x1.7mm BGA Packages Using Sn98.5%Ag1%Cu0.5% Solder Balls

Product Termination Notice (PTN) (1)

Nov 09, 2017
December 2012 Product Obsolescence Notification

IBIS (1)

BSDL (1)

Verilog (1)

VHDL (1)