You are here

CY8CMBR2044-24LKXI | Cypress Semiconductor

CY8CMBR2044-24LKXI

Status: In Production

Datasheet

(pdf, 994.67 KB) RoHS PB Free
Datasheet updated: March 11, 2016
(pdf, 730.13 KB) RoHS PB Free
Datasheet updated: March 11, 2016

CY8CMBR2044-24LKXI

Development KitNone
Automotive QualifiedN
CapSenseY
Comm. InterfaceGPO
Max. Operating Temp. (°C)85
Max. Operating Voltage (V)5.50
Min. Operating Temp. (°C)-40
Min. Operating Voltage (V)1.71
No. of CapSense IO4
No. of Dedicated I2C0
No. of Dedicated SPI0
No. of GPIOs4
No. of GPOs4
No. of PWM Channels0
PWMsN
Proximity SensingN
Slider SegmentsN/A
SmartSense EnabledY
Tape & ReelN

Pricing & Inventory Availability

1-9 unit Price* 10-24 unit Price* 25-99 unit Price* 100-249 unit Price* 250-999 unit Price* 1000+ unit Price*
$1.22 $1.16 $1.11 $1.06 $1.01 $0.93
Availability Quantity Ships In Order Now
In Stock 50 24-48 hours

Packaging/Ordering

Package
QFN
No. of Pins
16
Package Dimensions
118 L x 23 H x 118 W (Mils)
Package Weight
15.57 (mgs)
Package Cross Section Drawing
Package Carrier
TRAY
Package Carrier Drawing / Orientation
Standard Pack Quantity
490
Minimum Order Quantity (MOQ)
490
Order Increment
490
Estimated Lead Time (days)
42
HTS Code
8542.31.0000
ECCN
None
ECCN Suball
EAR99

Quality and RoHS

Moisture Sensitivity Level (MSL)
3
Peak Reflow Temp. (°C)
PB Free
Y
Lead/Ball Finish
Ni/Pd/Au

RoHS Analysis Certificates (CoA) for Direct Materials

Please click here

Package Qualification Report

Device Qualification Reports

Technical Documents

Development Kits/Boards (1)

Software and Drivers (1)

Product Change Notice (PCN) (5)

Feb 08, 2016
Qualification of ASE Taiwan as an additional assembly site for all Quad Flat No-Lead (QFN) packaged products
Feb 08, 2016
Qualification of Copper Wire Bonds for Quad Flat No-Lead (QFN) Products
Feb 08, 2016
Qualification of Cypress Minnesota Inc. as an alternative wafer fabrication site and Copper Palladium as an alternative wire bond option for select PSoC Capsense Controller Product families
Feb 07, 2016
Q1, 2012 - Q2, 2013 Horizon Report
Oct 04, 2012
Q2, 2012 - Q4, 2013 Horizon Report

Product Information Notice (PIN) (6)

Feb 05, 2016
Qualification of Kostat Shipping Tray for Products in 16-QFN 3x3 Package
Feb 05, 2016
Barcode Inclusion on Cypress Packing List
Feb 05, 2016
Improvement of Cypress Minnesota Back-End-of-Line Integration for 130nm SONOS Product Families
Feb 05, 2016
Changes to Cypress Address Labels
Feb 05, 2016
Qualification of New Carrier Tape Supplier at Cypress Philippines
Feb 05, 2016
GSMC Merger with HH-NEC to Form HHGrace Semiconductor Manufacturing Corporation

IBIS (2)

Mar 04, 2014
Mar 04, 2014