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CY8C5868LTI-LP039 | Cypress

CY8C5868LTI-LP039

Status: In Production

Datasheet

(zip, 696.26 KB) RoHS PB Free
Datasheet updated: May 09, 2016
(zip, 822.45 KB) RoHS PB Free
Datasheet updated: May 09, 2016

CY8C5868LTI-LP039

Development KitCY8CKIT-050
Automotive QualifiedN
Boost Converter (Volts)0.5
CPU CoreARM Cortex-M3
CapSenseY
Dedicated ADC (#_ Max Resolution @ Sample Rate)DelSig (1, 20-bit @ 180 sps), SAR (2, 12-bit @ 1000 ksps)
Dedicated DAC (#_ Max Resolution @ Sample Rate)(4, 8-bit @ 8 msps)
EEPROM (KB)2
Flash (KB)256
LCD Direct Drive (Yes/No)Y
Max. Operating Frequency (MHz)67
Max. Operating Temp. (°C)85
Max. Operating Voltage (V)5.50
Min. Operating Temp. (°C)-40
Min. Operating Voltage (V)1.71
No. of CAN Controllers1
No. of DMA Channels24
No. of Dedicated Comparators4
No. of Dedicated Digital Filter Blocks1
No. of Dedicated I2C1
No. of Dedicated OpAmps2
No. of Dedicated SPI0
No. of Dedicated Timer/Counter/PWM Blocks4
No. of Dedicated UART0
No. of GPIOs38
No. of Programmable Analog Blocks4
No. of Programmable Universal Digital Blocks24
No. of SIO8
No. of USB IO2
SRAM (KB)64
USB (Type)Full-Speed

Pricing & Inventory Availability

1-9 unit Price* 10-24 unit Price* 25-99 unit Price* 100-249 unit Price* 250-999 unit Price* 1000+ unit Price*
$13.14 $12.59 $12.04 $11.49 $10.94 $10.02
Availability Quantity Ships In Order Now
In Stock 622 24-48 hours

Packaging/Ordering

Package
QFN
No. of Pins
68
Package Dimensions
315 L x 35 H x 315 W (Mils)
Package Weight
177.81 (mgs)
Package Cross Section Drawing
Package Carrier
TRAY
Package Carrier Drawing / Orientation
Standard Pack Quantity
260
Minimum Order Quantity (MOQ)
260
Order Increment
260
Estimated Lead Time (days)
28
HTS Code
8542.31.0000
ECCN
(A.3)
ECCN Suball
3A991

Quality and RoHS

Moisture Sensitivity Level (MSL)
3
Peak Reflow Temp. (°C)
PB Free
Y
Lead/Ball Finish
Ni/Pd/Au

Package Material Declaration

Last Update: Dec 22, 2015

IPC 1752 Material Declaration

Last Update: Aug 29, 2012
Last Update: Aug 29, 2012

RoHS Analysis Certificates (CoA)

Device Qualification Reports

FIT/MTBF, ESD (HBM/CDM) and Latch-up data available in the Device Qualification Report.

Technical Documents

Application Notes (9)

Product Change Notice (PCN) (1)

Feb 08, 2016
Qualification of Manufacturing Changes for PSoC 5LP Products

Product Information Notice (PIN) (4)

Feb 05, 2016
Barcode Inclusion on Cypress Packing List
Feb 05, 2016
Improvement of Cypress Minnesota Back-End-of-Line Integration for 130nm SONOS Product Families
Feb 05, 2016
Changes to Cypress Address Labels
Feb 05, 2016
GSMC Merger with HH-NEC to Form HHGrace Semiconductor Manufacturing Corporation

Boundary Scan BSDL (4)