CY8C5868LTI-LP039 | Cypress Semiconductor

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CY8C5868LTI-LP039
Status: In Production

Datasheet

(pdf, 6.33 MB) RoHS PB Free
(pdf, 4.28 MB) RoHS PB Free

CY8C5868LTI-LP039

Development KitCY8CKIT-050
Automotive QualifiedN
Boost Converter (Volts)0.5
CPU CoreARM Cortex-M3
CapSenseY
Dedicated ADC (#_ Max Resolution @ Sample Rate)DelSig (1, 20-bit @ 180 sps), SAR (2, 12-bit @ 1000 ksps)
Dedicated DAC (#_ Max Resolution @ Sample Rate)(4, 8-bit @ 8 msps)
EEPROM (KB)2
Flash (KB)256
LCD Direct Drive (Yes/No)Y
Max. Operating Frequency (MHz)67
Max. Operating Temp. (°C)85
Max. Operating Voltage (V)5.50
Min. Operating Temp. (°C)-40
Min. Operating Voltage (V)1.71
No. of CAN Controllers1
No. of DMA Channels24
No. of Dedicated Comparators4
No. of Dedicated Digital Filter Blocks1
No. of Dedicated I2C1
No. of Dedicated OpAmps2
No. of Dedicated SPI0
No. of Dedicated Timer/Counter/PWM Blocks4
No. of Dedicated UART0
No. of GPIOs38
No. of Programmable Analog Blocks4
No. of Programmable Universal Digital Blocks24
No. of SIO8
No. of USB IO2
Part FamilyPSoC 5LP
SRAM (KB)64
SeriesPSoC 5800
Tape & ReelN
USB (Type)Full-Speed

Pricing & Inventory Availability

1-9 unit Price* 10-24 unit Price* 25-99 unit Price* 100-249 unit Price* 250-999 unit Price* 1000+ unit Price*
$13.14 $12.59 $12.04 $11.49 $10.94 $10.02
Availability Quantity Ships In Buy from Cypress Buy from Distributors
In Stock 524 24-48 hours

Packaging/Ordering

Package
QFN
No. of Pins
68
Package Dimensions
315 L x 35 H x 315 W (Mils)
Package Weight
177.81 (mgs)
Package Cross Section Drawing
Package Carrier
TRAY
Package Carrier Drawing / Orientation
Standard Pack Quantity
260
Minimum Order Quantity (MOQ)
260
Order Increment
260
Estimated Lead Time (days)
91
HTS Code
8542.31.0001
ECCN
(A.3)
ECCN Suball
3A991

Quality and RoHS

Moisture Sensitivity Level (MSL)
3
Peak Reflow Temp. (°C)
PB Free
Y
Lead/Ball Finish
Ni/Pd/Au

Package Material Declaration

IPC 1752 Material Declaration

Device Qualification Reports

FIT/MTBF, ESD (HBM/CDM) and Latch-up data available in the Device Qualification Report.

Technical Documents

Application Notes (8)

Product Change Notice (PCN) (1)

Oct 25, 2017
Qualification of Manufacturing Changes for PSoC 5LP Products

Product Information Notice (PIN) (3)

Nov 06, 2017
GSMC Merger with HH-NEC to Form HHGrace Semiconductor Manufacturing Corporation
Nov 06, 2017
Changes to Cypress Address Labels
Nov 06, 2017
Improvement of Cypress Minnesota Back-End-of-Line Integration for 130nm SONOS Product Families

Boundary Scan BSDL (4)