CY8C5467LTI-LP003 | Cypress Semiconductor
CY8C5467LTI-LP003
| Development Kit | CY8CKIT-050 |
| Automotive Qualified | N |
| Boost Converter (Volts) | 0.5 |
| CPU Core | ARM Cortex-M3 |
| CapSense | Y |
| Dedicated ADC (#_ Max Resolution @ Sample Rate) | SAR (1, 12-bit @ 1000 ksps) |
| Dedicated DAC (#_ Max Resolution @ Sample Rate) | (2, 8-bit @ 8 msps) |
| EEPROM (KB) | 2 |
| Flash (KB) | 128 |
| LCD Direct Drive (Yes/No) | Y |
| Max. Operating Frequency (MHz) | 67 |
| Max. Operating Temp. (°C) | 85 |
| Max. Operating Voltage (V) | 5.50 |
| Min. Operating Temp. (°C) | -40 |
| Min. Operating Voltage (V) | 1.71 |
| No. of CAN Controllers | 0 |
| No. of DMA Channels | 24 |
| No. of Dedicated Comparators | 4 |
| No. of Dedicated Digital Filter Blocks | 0 |
| No. of Dedicated I2C | 1 |
| No. of Dedicated OpAmps | 2 |
| No. of Dedicated SPI | 0 |
| No. of Dedicated Timer/Counter/PWM Blocks | 4 |
| No. of Dedicated UART | 0 |
| No. of GPIOs | 38 |
| No. of Programmable Analog Blocks | 2 |
| No. of Programmable Universal Digital Blocks | 24 |
| No. of SIO | 8 |
| No. of USB IO | 2 |
| Part Family | PSoC 5LP |
| SRAM (KB) | 32 |
| Series | PSoC 5400 |
| Tape & Reel | N |
| USB (Type) | Full-Speed |
Pricing & Inventory Availability
| 1-9 unit Price* | 10-24 unit Price* | 25-99 unit Price* | 100-249 unit Price* | 250-999 unit Price* | 1000+ unit Price* |
|---|---|---|---|---|---|
| $4.89 | $4.69 | $4.48 | $4.28 | $4.07 | $3.73 |
Packaging/Ordering
Package
No. of Pins
68
Package Dimensions
315 L x 35 H x 315 W (Mils)
Package Weight
177.81 (mgs)
Package Cross Section Drawing
Package Carrier
TRAY
Package Carrier Drawing / Orientation
Standard Pack Quantity
260
Minimum Order Quantity (MOQ)
260
Order Increment
260
Estimated Lead Time (days)
126
HTS Code
8542.31.0001
ECCN
(A.3)
ECCN Suball
3A991
Quality and RoHS
Moisture Sensitivity Level (MSL)
3
Peak Reflow Temp. (°C)
260 (Cypress Reflow Profile)
RoHS Compliant
PB Free
Y
Lead/Ball Finish
Ni/Pd/Au
Marking
Package Material Declaration
Last Update: Feb 01, 2017
IPC 1752 Material Declaration
Last Update: Nov 10, 2016
Last Update: Nov 09, 2016
Device Qualification Reports
FIT/MTBF, ESD (HBM/CDM) and Latch-up data available in the Device Qualification Report.
Last Update: Sep 16, 2016
Technical Documents
Application Notes (8)
Jul 31, 2017
Product Change Notice (PCN) (1)
Product Information Notice (PIN) (4)
Feb 05, 2016
Improvement of Cypress Minnesota Back-End-of-Line Integration for 130nm SONOS Product Families
Feb 05, 2016
GSMC Merger with HH-NEC to Form HHGrace Semiconductor Manufacturing Corporation