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CY8C5287AXI-LP095 | Cypress Semiconductor

CY8C5287AXI-LP095

Status: In Production

Datasheet

(zip, 696.26 KB) RoHS PB Free
Datasheet updated: November 14, 2016
(zip, 822.45 KB) RoHS PB Free
Datasheet updated: November 14, 2016

CY8C5287AXI-LP095

Development KitCY8CKIT-050
Automotive QualifiedN
Boost Converter (Volts)0.5
CPU CoreARM Cortex-M3
CapSenseY
Dedicated ADC (#_ Max Resolution @ Sample Rate)SAR (1, 12-bit @ 1000 ksps)
Dedicated DAC (#_ Max Resolution @ Sample Rate)(1, 8-bit @ 8 msps)
EEPROM (KB)2
Flash (KB)256
LCD Direct Drive (Yes/No)Y
Max. Operating Frequency (MHz)80
Max. Operating Temp. (°C)85
Max. Operating Voltage (V)5.50
Min. Operating Temp. (°C)-40
Min. Operating Voltage (V)1.71
No. of CAN Controllers0
No. of DMA Channels24
No. of Dedicated Comparators0
No. of Dedicated Digital Filter Blocks0
No. of Dedicated I2C1
No. of Dedicated OpAmps0
No. of Dedicated SPI0
No. of Dedicated Timer/Counter/PWM Blocks4
No. of Dedicated UART0
No. of GPIOs62
No. of Programmable Analog Blocks0
No. of Programmable Universal Digital Blocks24
No. of SIO8
No. of USB IO2
SRAM (KB)64
Tape & ReelN
USB (Type)Full-Speed

Pricing & Inventory Availability

1-9 unit Price* 10-24 unit Price* 25-99 unit Price* 100-249 unit Price* 250-999 unit Price* 1000+ unit Price*
$5.81 $5.56 $5.32 $5.08 $4.83 $4.43
Availability Quantity Ships In Order Now
In Stock 125 24-48 hours

Packaging/Ordering

Package
No. of Pins
100
Package Dimensions
551 L x 55 H x 551 W (Mils)
Package Weight
637.75 (mgs)
Package Cross Section Drawing
Package Carrier
TRAY
Package Carrier Drawing / Orientation
Standard Pack Quantity
90
Minimum Order Quantity (MOQ)
90
Order Increment
90
Estimated Lead Time (days)
28
HTS Code
8542.31.0000
ECCN
(A.3)
ECCN Suball
3A991

Quality and RoHS

Moisture Sensitivity Level (MSL)
3
Peak Reflow Temp. (°C)
PB Free
Y
Lead/Ball Finish
Ni/Pd/Au

Package Material Declaration

Device Qualification Reports

FIT/MTBF, ESD (HBM/CDM) and Latch-up data available in the Device Qualification Report.

Technical Documents

Product Change Notice (PCN) (1)

Feb 08, 2016
Qualification of Copper Palladium Wire Bonds for Select Lead Frame Products at JCET China