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CY8C3866LTI-068 | Cypress Semiconductor

CY8C3866LTI-068

Status: In Production

Datasheet

(pdf, 12.94 MB) RoHS PB Free
Datasheet updated: July 11, 2016
(zip, 443.27 KB) RoHS PB Free
Datasheet updated: July 11, 2016
(pdf, 3.63 MB) RoHS PB Free
Datasheet updated: July 11, 2016
(zip, 532.78 KB) RoHS PB Free
Datasheet updated: July 11, 2016

CY8C3866LTI-068

Development KitCY8CKIT-001
Automotive QualifiedN
Boost Converter (Volts)0.5
CPU Core8051
CapSenseY
Dedicated ADC (#_ Max Resolution @ Sample Rate)DelSig (1, 20-bit @ 180 sps)
Dedicated DAC (#_ Max Resolution @ Sample Rate)(4, 8-bit @ 8 msps)
EEPROM (KB)2
Flash (KB)64
LCD Direct Drive (Yes/No)Y
Max. Operating Frequency (MHz)67
Max. Operating Temp. (°C)85
Max. Operating Voltage (V)5.50
Min. Operating Temp. (°C)-40
Min. Operating Voltage (V)1.71
No. of CAN Controllers1
No. of DMA Channels24
No. of Dedicated Comparators4
No. of Dedicated Digital Filter Blocks1
No. of Dedicated I2C1
No. of Dedicated OpAmps2
No. of Dedicated SPI0
No. of Dedicated Timer/Counter/PWM Blocks4
No. of Dedicated UART0
No. of GPIOs25
No. of Programmable Analog Blocks4
No. of Programmable Universal Digital Blocks24
No. of SIO4
No. of USB IO2
SRAM (KB)8
Tape & ReelN
USB (Type)Full-Speed

Pricing & Inventory Availability

1-9 unit Price* 10-24 unit Price* 25-99 unit Price* 100-249 unit Price* 250-999 unit Price* 1000+ unit Price*
$10.05 $9.63 $9.21 $8.79 $8.37 $7.66
Availability Quantity Ships In Order Now
In Stock 180 24-48 hours

Packaging/Ordering

Package
QFN
No. of Pins
48
Package Dimensions
276 L x 276 H x 35 W (Mils)
Package Cross Section Drawing
Package Carrier
TRAY
Package Carrier Drawing / Orientation
Standard Pack Quantity
260
Minimum Order Quantity (MOQ)
260
Order Increment
260
Estimated Lead Time (days)
63
HTS Code
8542.31.0000
ECCN
(A.3)
ECCN Suball
3A991

Quality and RoHS

Moisture Sensitivity Level (MSL)
3
Peak Reflow Temp. (°C)
PB Free
Y
Lead/Ball Finish
Ni/Pd/Au

Package Material Declaration

IPC 1752 Material Declaration

RoHS Analysis Certificates (CoA) for Direct Materials

Please click here

Device Qualification Reports

FIT/MTBF, ESD (HBM/CDM) and Latch-up data available in the Device Qualification Report.

Technical Documents

Product Change Notice (PCN) (7)

Feb 08, 2016
Qualification of ASE Taiwan as an additional assembly site for all Quad Flat No-Lead (QFN) packaged products
Feb 08, 2016
Qualification of Copper Wire Bonds for Quad Flat No-Lead (QFN) Products
Feb 08, 2016
Qualification of Manufacturing and Design Changes for PSoC 3 Products
Feb 08, 2016
Addendum to PCN 135245: Qualification of Manufacturing and Design Changes for PSoC 3 Products
Feb 07, 2016
Q1, 2012 - Q2, 2013 Horizon Report
Nov 02, 2015
Qualification of Manufacturing and Design Changes for PSoC 3 Products
Oct 04, 2012
Q2, 2012 - Q4, 2013 Horizon Report

Product Information Notice (PIN) (4)

Feb 05, 2016
Datasheet changes-PSoC 3 Products
Feb 05, 2016
Improvement of Cypress Minnesota Back-End-of-Line Integration for 130nm SONOS Product Families
Feb 05, 2016
Changes to Cypress Address Labels
Feb 05, 2016
PSoC Programmer Upgrade for PSoC 3 Family of Products

Boundary Scan BSDL (2)